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目的:
1. 测量试验的实用效果可使我们提早发现和改进任何物料和过程的问题
2. 从生产线抽组件样品,做以下试验

周测方法
◎ 高温贮存:
To determine electrical and mechanical characteristics of the device. (at TJ maximum / 24 hr.)
◎ 焊锡附着性:
To determine the solder coverage on the device. (MIL-STD-202F, method208)
◎ 溶剂耐力:
To verify that the marking or color-coding will not become illegible,
discolored or show any other type of deterioration. (MIL-STD-202F, method 215)

月测方法
◎ 焊锡耐热性: (MIL-STD-750C, method 2031.1)
To determine the resistance of the device to the high temperature encountered
during soldering operation TA = 260±5 °C/T = 10~12 sec.
◎ 温湿试验: (MIL-STD-202F, method 103.1)
To evaluate the properties of materials subjected to high humidity.
Condition: RH = 98% / TA = 65 °C/T = 24~500 hrs.
◎ 高压蒸煮试验:
To verify the properties and quality of the molding compound.
TA = 121 °C / 15 PSIG / T = 24~96 hrs.
◎ 温度循环试验: (MIL-STD-750C, method-1051)
To determine the resistance of the device when exposed to extremely high and low temperatures.

Condition
TH = 125 °C / 150 °C 30 minutes
TR = 25 °C 15 minutes
TC = -55°C / -66 °C 30 minutes

◎ 温度冲击: (MIL-STD-750C, method-1056)
To determine the resistance of the device with sudden extreme changes in temperature.

Condition
TH = 100 °C / 125 °C / 150 °C 5 minutes
TC = 0 °C / -40 °C / -55 °C / -65 °C 5 minutes

◎ 顺向电流试验: (MIL-STD-750C, method-1027)
To determine the ability of the device to withstand operation at rated forward current.
◎ 起停顺向电流试验: (MIL-STD-750C, method-1036)
To determine electrical application of the device with practical simulation.
◎ 高温逆向试验: (MIL-STD-750C, method-1026)
To determine characteristics of the device under high temperature reverse bias.
◎ 高温存放: (MIL-STD-750C, method-1031)
To determine electrical and mechanical characteristics of the device under high temperature conditions.

季测及方法
◎ 震动测试: (MIL-STD-202F, method 201A)
To evaluate the endurance of a device against vibration.
◎ 碰撞测试: (MIL-STD-202F, method 207A)
To determine the ability of various parts to withstand shock.
◎ 温度抵抗测试: (MIL-STD-750C, method 4066-2)
To test the device‘s thermal resistance between junction and ambient.
◎ 顺向电流冲击: (MIL-STD-750C, method-4066-2)
To determine the surge capability of the device.
◎ 拉力测试: (MIL-STD-750C, method-2036)
To determine the mechanical and stress ability of the device.

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