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测试实验 测试条件 依据
1. Solder Resistance 焊锡耐热性 @260±5°C for 10±2 sec.
Immerse body into solder 1/16“±1/32”
MIL-STD-750C
METHOD-2031
2. Solderability焊锡附着性 @230±5°C for 5 sec. MIL-STD-202F
METHOD-208
3. Pull 拉力试验 2 Kg in axial lead direction for 10 sec. MIL-STD-750C
METHOD-2036
4. Bend Lead 弯曲试验 0.5 Kg weight applied to each lead bending
arc 90°±5° for 3 times
MIL-STD-750C
METHOD-2036
5. High Temperature Reverse Bias  高温逆向电压试验 VR=80% Rated @ TA=100°C FOR 168/500Hr. MIL-STD-750C
METHOD-1026
6. Operation Life顺向动作生命 Rated average rectifier current@ TA=25°C for 168/1000 hrs. MIL-STD-750C
METHOD-1027
7. Intermittent Operation Life
  断续通电寿命试验
On state: TJ=125°C-175°C with rated IRMS power for 5 min.
Off state: TJ= TA+15°C with cool forced air, on and off for 1000 cycles
MIL-STD-750C
METHOD-1036
8. Pressure Cooker 压力锅 15 PSIG @ TA=121° for 4 hrs.  
9. Temperature Cycling
  温度循环
-55°C to + 125°C dwelled for 15 min. and transferred for 5 min., total 10 cycles MIL-STD-750C
METHOD-1051
10. Thermal Shock温度冲击 0°C for 5 min., rise to 100°C for 5 min.,total 10 cycles MIL-STD-750C
METHOD-1056
11. Forward Surge顺向电流冲击 8.3 ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750
METHOD-4066-2
12. Humidity 恒温恒湿试验 @ TA=65°C, RH=98% for 168/500 hrs. MIL-STD-202F
METHOD-1038
13. High Temperature Storage Life
  高温存放寿命
@150° for 168/500 hrs. MIL-STD-750C
METHOD-1031
14. Solvent Resistance Dip into freon @ 25°C for 1 min. MIL-STD-202F
METHOD-215
* UPM performs the above reliability experiments by using MIL-STD-195000.
* UPM‘s devices meet the requirements of reliability tests.

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