MAIL 英文版 繁體版 簡體版
 
About us |
Contact us |
Products Listing |
DATA BOOK |
ISO 9001
 
 Photograph
 Company Profile
 Organizaty Assurance Policy
 Major Materials Approved Supplier List
 Engineering and Quality Control System
 Calibration System
 Flow Chart of the Manufacturing Process
 System of Quality Service & Claim Action Route
 Main Functions of the Quality Control Department
 Weekly Test
 Reliability Experiment
 Targets and Schedule

 


Weekly Test
◎ High Temperature Storage:
To determine electrical and mechanical characteristics of the device.
(at TJ maximum / 24 hr.)
◎ Solderability:
To determine the solder coverage on the device.
(MIL-STD-202F,method 208)
◎ Solvent Resistance:
To verify that the marking or color-coding will not become illegible,
discolored or show any other type of deterioration.
(MIL-STD-202F,method 215)

Monthly Test
◎ Solder Resistance: (MIL-STD-750C, method 2031.1)
To determine the resistance of the device to the high temperature encountered
during soldering operation TA = 260±5 °C /T = 10~12 sec.
◎ Humidity Test: (MIL-STD-202F, method 103.1)
To evaluate the properties of materials subjected to high humidity.
Condition: RH = 98% / TA = 65 °C /T = 24~500 hrs.
◎ Pressure Cooker:
To verify the properties and quality of the molding compound.
TA = 121 °C / 15 PSIG / T = 24~96 hrs.
◎Temperature Cycling: (MIL-STD-750C, method-1051)
To determine the resistance of the device when exposed to extremely high and low temperatures.
Condition
TH = 125 °C / 150 °C 30 minutes
TR = 25 °C 15 minutes
TC = -55°C / -66 °C 30 minutes

◎ Thermal Shock: (MIL-STD-750C, method-1056)
To determine the resistance of the device with sudden extreme changes in temperature.
Condition
TH = 100 °C / 125 °C / 150 °C 5 minutes
TC = 0 °C / -40 °C / -55 °C / -65 °C 5 minutes


◎ Forward Life: (MIL-STD-750C, method-1027)
To determine the ability of the device to withstand operation at rated forward current.
Forward On-Off Life Test : (MIL-STD-750C, method-1036)
To determine electrical application of the device with practical simulation.
High Temperature Reverse Bias : (MIL-STD-750C, method-1026)
To determine characteristics of the device under high temperature reverse bias.
High Temperature Storage : (MIL-STD-750C, method-1031)
To determine electrical and mechanical characteristics of the device under high temperature conditions.

Quarterly Test and Measurement
Vibration Test : (MIL-STD-202F, method 201A)
To evaluate the endurance of a device against vibration.
Impact Shock : (MIL-STD-202F, method 207A)
To determine the ability of various parts to withstand shock.
Thermal Resistance : (MIL-STD-750C, method 4066-2)
To test the device‘s thermal resistance between junction and ambient.
Forward Surge : (MIL-STD-750C, method-4066-2)
To determine the surge capability of the device.
Terminal Strength : (MIL-STD-750C, method-2036)
To determine the mechanical and stress ability of the device.

7th Floor, #208, Ta-Tung Road, Section 3,Hsi-Chih City, Taipei , Taiwan, R.O.C.
Telephone: 886-2-86473430 Fax: 886-2-86473450