◎ 焊錫耐熱性: (MIL-STD-750C, method 2031.1)
To determine the resistance of the device to the high temperature encountered
during soldering operation TA = 260±5 °C/T = 10~12 sec.
◎ 溫濕試驗: (MIL-STD-202F, method 103.1)
To evaluate the properties of materials subjected to high humidity.
Condition: RH = 98% / TA = 65 °C/T = 24~500 hrs.
To verify the properties and quality of the molding compound.
TA = 121 °C / 15 PSIG / T = 24~96 hrs.
◎ 溫度循環試驗: (MIL-STD-750C, method-1051)
To determine the resistance of the device when exposed to extremely high and low temperatures.
|TH = 125 °C / 150 °C
|TR = 25 °C
|TC = -55°C / -66 °C
◎ 溫度衝擊: (MIL-STD-750C, method-1056)
To determine the resistance of the device with sudden extreme changes in temperature.
|TH = 100 °C / 125 °C / 150 °C
|TC = 0 °C / -40 °C / -55 °C / -65 °C
◎ 順向電流試驗: (MIL-STD-750C, method-1027)
To determine the ability of the device to withstand operation at rated forward current.
◎ 起停順向電流試驗: (MIL-STD-750C, method-1036)
To determine electrical application of the device with practical simulation.
◎ 高溫逆向試驗: (MIL-STD-750C, method-1026)
To determine characteristics of the device under high temperature reverse bias.
◎ 高溫存放: (MIL-STD-750C, method-1031)
To determine electrical and mechanical characteristics of the device under high temperature conditions.