MAIL 英文版 繁體版 簡體版
 
關於我們 |
聯絡方式 |
產品列表(英) |
DATA BOOK(英) |
ISO 9001
 
  公司照片
  公司簡介
  品質保證政策
  主要原物料合格供應商
 工程與品質納制系統
 校正系統
 品質管制
 服務行動和產品認可回饋
 品質部門主要功能
 品質改進計畫
 信賴度實驗
 百萬分之一計劃(PPM) 和 過程統計控制(SPC)

 


目的︰
1. 測量試驗的實用效果可使我們提早發現和改進任何物料和過程的問題
2. 從生產線抽組件樣品,做以下試驗

周測方法
◎ 高溫貯存:
To determine electrical and mechanical characteristics of the device. (at TJ maximum / 24 hr.)
◎ 焊錫附著性:
To determine the solder coverage on the device. (MIL-STD-202F, method208)
◎ 溶劑耐力:
To verify that the marking or color-coding will not become illegible,
discolored or show any other type of deterioration. (MIL-STD-202F, method 215)

月測方法
◎ 焊錫耐熱性: (MIL-STD-750C, method 2031.1)
To determine the resistance of the device to the high temperature encountered
during soldering operation TA = 260±5 °C/T = 10~12 sec.
◎ 溫濕試驗: (MIL-STD-202F, method 103.1)
To evaluate the properties of materials subjected to high humidity.
Condition: RH = 98% / TA = 65 °C/T = 24~500 hrs.
◎ 高壓蒸煮試驗:
To verify the properties and quality of the molding compound.
TA = 121 °C / 15 PSIG / T = 24~96 hrs.
◎ 溫度循環試驗: (MIL-STD-750C, method-1051)
To determine the resistance of the device when exposed to extremely high and low temperatures.

Condition
TH = 125 °C / 150 °C 30 minutes
TR = 25 °C 15 minutes
TC = -55°C / -66 °C 30 minutes

◎ 溫度衝擊: (MIL-STD-750C, method-1056)
To determine the resistance of the device with sudden extreme changes in temperature.

Condition
TH = 100 °C / 125 °C / 150 °C 5 minutes
TC = 0 °C / -40 °C / -55 °C / -65 °C 5 minutes

◎ 順向電流試驗: (MIL-STD-750C, method-1027)
To determine the ability of the device to withstand operation at rated forward current.
◎ 起停順向電流試驗: (MIL-STD-750C, method-1036)
To determine electrical application of the device with practical simulation.
◎ 高溫逆向試驗: (MIL-STD-750C, method-1026)
To determine characteristics of the device under high temperature reverse bias.
◎ 高溫存放: (MIL-STD-750C, method-1031)
To determine electrical and mechanical characteristics of the device under high temperature conditions.

季測及方法
◎ 震動測試: (MIL-STD-202F, method 201A)
To evaluate the endurance of a device against vibration.
◎碰撞測試: (MIL-STD-202F, method 207A)
To determine the ability of various parts to withstand shock.
◎ 溫度抵抗測試: (MIL-STD-750C, method 4066-2)
To test the device‘s thermal resistance between junction and ambient.
◎ 順向電流衝擊: (MIL-STD-750C, method-4066-2)
To determine the surge capability of the device.
◎ 拉力測試: (MIL-STD-750C, method-2036)
To determine the mechanical and stress ability of the device.

台灣台北縣汐止市大同路三段208號7樓
電 話: 886-2-86473430 傳 真: 886-2-86473450